{"id":1791,"date":"2026-03-12T10:52:58","date_gmt":"2026-03-12T02:52:58","guid":{"rendered":"https:\/\/www.manz.com.tw\/?post_type=news&p=1791"},"modified":"2026-03-12T13:21:07","modified_gmt":"2026-03-12T05:21:07","slug":"manz_epson","status":"publish","type":"news","link":"https:\/\/www.manz.com.tw\/en\/news\/manz_epson\/","title":{"rendered":"Manz Asia and Epson Form Strategic Partnership to Advance Inkjet Technology for Semiconductor Manufacturing"},"content":{"rendered":"\n

Joint Lab-to-Fab inkjet equipment combines Epson\u2019s precision printhead technology with Manz Asia\u2019s equipment and process expertise to enable scalable manufacturing<\/strong><\/p>\n\n\n\n

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Taoyuan, Taiwan \u2014 March 12, 2026<\/strong> \u2014 A leading semiconductor advanced packaging equipment manufacturer Manz Asia today announced a strategic partnership with Seiko Epson Corporation (Epson) aimed at accelerating the adoption of advanced inkjet technology in semiconductor manufacturing.<\/p>\n\n\n\n

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The collaboration combines Manz Asia\u2019s expertise in semiconductor equipment engineering, process integration, and intelligent software systems with Epson\u2019s industry-leading inkjet printhead technology. By bringing together these complementary capabilities, the two companies are developing scalable Lab-to-Fab inkjet equipment designed to support next-generation semiconductor manufacturing applications.<\/p>\n\n\n\n

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The jointly developed inkjet equipment is available as a series of systems covering R&D, pilot production, and mass manufacturing, enabling semiconductor manufacturers to expand applications, validate materials efficiently, optimize process parameters, and scale seamlessly from development to high-volume production.<\/p>\n\n\n\n

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Manz Asia\u2019s inkjet system solutions with high compatibility features enable precise 2D and 3D printing of conductive, photoresist, and specialized functional inks on a variety of products, components, and surfaces. The systems are well-suited for key semiconductor processes, including patterning 2.5D\/3D antenna traces, heatsink layers, and bonding layers for RFIC, PMIC, and CPO devices. All of these applications can be handled with Manz Asia inkjet system solutions, providing flexible, scalable, and cost-effective solutions for advanced packaging and emerging device architectures.<\/p>\n\n\n\n

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Robert Lin, CEO of Manz Asia, said: \u201cInkjet technology is transforming semiconductor manufacturing. Together with Epson, we are delivering precise and scalable inkjet equipment solutions that enable manufacturers to validate processes and scale from R&D to high-volume production. Our Taiwan R&D center serves as an open innovation hub, uniting materials partners, printhead providers, and key suppliers, turning innovative concepts into practical manufacturing outcomes and helping customers achieve faster time-to-market and improved production efficiency.\u201d<\/p>\n\n\n\n

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Shunya Fukuda, COO of Epson\u2019s IJS Operations Division, added: \u201cDigital additive manufacturing using inkjet technology is expected to become a key technology supporting the evolution of semiconductor packaging. By leveraging Epson\u2019s high-precision droplet control technology and volume production know-how developed, we works together with Manz Asia to build a scalable manufacturing platform bridging laboratory development and volume production. Through this initiative, Epson aims to contribute to the sustainable development of the semiconductor industry.\u201d<\/p>\n\n\n\n

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This collaboration marks a step toward more flexible, efficient, and sustainable semiconductor production, leveraging complementary core technologies to deliver long-term differentiation and measurable value to global customers.<\/p>\n\n\n\n

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Picture 1: RDJet100 \u2500 a laboratory equipment for validating new functional inks and substrates in semiconductor advanced packaging metallization process. Powered by Epson printhead.<\/p>\n\n\n\n

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Picture 2: ICJet series \u2500 Industrial production equipment for frontend and backend semiconductor processes, supporting wafer and panel substrates.<\/p>\n\n\n\n

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Picture 3: Manz Asia and Epson have teamed to deliver inkjet system solutions for semiconductor processes\u20142.5D\/3D antennas traces, heatsinks, and bonding layers for RFIC\/PMIC\/CPO\u2014enabling transformative production advances.<\/p>\n\n\n\n

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About Manz Asia<\/strong><\/p>\n\n\n\n

Manz Asia delivers semiconductor equipment and solutions built on core technologies in wet chemistry, plating, inkjet printing, automation, and software integration. Our expertise covers advanced packaging (High-Density PLP \/ FOPLP) and IC substrate processing (glass and organic core), supporting customers from R&D to high-volume manufacturing. Through system solutions, contract manufacturing, and sales representation, we help customers accelerate time-to-market, boost yield, and stay competitive in the fast-evolving semiconductor industry.<\/p>\n\n\n\n

www.manz.com.tw\/en<\/a><\/p>\n\n\n\n

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About SEIKO EPSON<\/strong><\/strong><\/p>\n\n\n\n

Epson is a global technology leader whose philosophy of efficient, compact, and precise innovation enriches lives and helps create a better world. Epson is focused on solving societal challenges through innovations in printing, manufacturing, and visual technologies, with the goal of becoming carbon negative and eliminating the use of exhaustible underground resources by 2050.
Led by Seiko Epson Corporation, the Epson Group generates annual sales of more than JPY 1 trillion.<\/p>\n\n\n\n

corporate.epson\/en\/<\/a><\/p>\n\n\n\n

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Contact:<\/strong><\/p>\n\n\n\n

Manz Taiwan Ltd.<\/p>\n\n\n\n

Yvonne Huang<\/p>\n\n\n\n

Director Marketing & Communications<\/p>\n\n\n\n

Phone: +886 3 452 9811 ext. 3399<\/p>\n\n\n\n

E-Mail: yvonne.huang@manz.com<\/p>\n","protected":false},"featured_media":0,"template":"","meta":{"_acf_changed":true},"class_list":["post-1791","news","type-news","status-publish","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.manz.com.tw\/en\/wp-json\/wp\/v2\/news\/1791","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.manz.com.tw\/en\/wp-json\/wp\/v2\/news"}],"about":[{"href":"https:\/\/www.manz.com.tw\/en\/wp-json\/wp\/v2\/types\/news"}],"wp:attachment":[{"href":"https:\/\/www.manz.com.tw\/en\/wp-json\/wp\/v2\/media?parent=1791"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}