Manz Asia is a leading manufacturer of equipment for semiconductor panel-level packaging. With a core focus on panel-level packaging technology, the company drives innovation in both the technology and processes of panel packaging.
With our technologies and innovative production solutions, we serve different sectors and industries. Our diversified positioning creates synergy effects from which our customers benefit greatly.
With our technologies and services, we always have the right solution for our customers. We see ourselves as a development partner who works out solutions together with our customers. We support you right from the start in numerous stages of development and design through to after-sales service.
Manz offers cleaning, developing, etching, and stripping processes in wet chemistry, primarily applied in the production of high-end semiconductor panel-level packaging (PLP), IC substrate, and display.
Flexible Applications, Superior Results
With nearly 40 years of experience in handling a variety of substrates in the photoresist process, our expertise ensures a high particle removal ratio, superior resolution, and thorough removal of remaining photoresist. This enables process flexibility across multiple applications.
Our equipment applies to the following fields:
Display
Semiconductor FOPLP
IC substrates & TGV (Through-glass via)
Our Capability
Semiconductor FOPLP
IC Substrate Core
IC Substrate TGV
Display
Material
EMC
FR-4
Glass
Glass
L/S
2/2
40/40 um
2/2 um
2/2 um
Substrate size
max. 700 x 700 mm
510 x 515 mm
510 x 515 mm
max. 2940 x 3370 mm (G10.5)
Your Benefits
High-precision gear configuration reduces vibration during transmission.
Drying section after blow-drying to prevent oxidation of the conductive layer.
High-uniformity spray plate configuration achieves small line width and spacing.
Horizontal and vertical automated loading and unloading system