The RDL interconnection layer in semiconductor chips is critical for producing high-quality end products. Achieving a reliable RDL process requires the use of premium plating equipment. In the technology sector, Manz offers delivers state-of-the-art jig-free copper plating equipment, ensuring superior performance and product quality. Our new vertical electroplating technology eliminates the need for traditional jigs, reducing both equipment and maintenance costs. Additionally, the modular design of our electroplating equipment allows for flexible configuration based on the customer’s production capacity and space requirements. The components are easy to operate and disassemble for straightforward maintenance, supporting efficient production and high uniformity. Uniformity: >90% L/S: 5/5 Via: 25 μm AR: 1:1

To meet the advanced Probe Card Multi-Layer Organic (MLO) substrate requirements for fine-line routing and stable performance, we provide key plating equipment designed specifically for Probe Card MLO manufacturing. With precise control of solution flow, it delivers uniform copper deposition on fine lines as well as inside vias and blind vias, improving reliability. The system supports critical copper plating processes for multilayer structures, offering strong filling capability and excellent uniformity for panel sizes up to 355 mm × 400 mm. Flexible process control, together with real-time data monitoring and control, ensures stable production, high quality, and high yield for HAR, multilayer Probe Card MLO substrates with various copper thicknesses.