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The key technology to achieve the RDL process in Panel Level Packaging and Through Glass Vias (TGV).
Helping Customers Achieve Greater Performance and Efficiency
In the rapidly evolving semiconductor industry, Panel Level Packaging (PLP) and Through Glass Via (TGV) have gained significant attention due to their ability to meet the increasing demands for higher performance and efficiency.

A critical technology is the role of plating equipment, which plays an essential role in ensuring the reliability and functionality of the final products.
The Key Technology to Achieve RDL Process — Novel Vertical Plating
The RDL interconnection layer in semiconductor chips is critical for producing high-quality end products. Achieving a reliable RDL process requires the use of premium plating equipment.

In the technology sector, Manz offers delivers state-of-the-art jig-free copper plating equipment, ensuring superior performance and product quality.
Our new vertical electroplating technology eliminates the need for traditional jigs, reducing both equipment and maintenance costs. Additionally, the modular design of our electroplating equipment allows for flexible configuration based on the customer's production capacity and space requirements.

The components are easy to operate and disassemble, facilitating straightforward maintenance and enabling efficient production.
Your Benefits
  • Uniformity: > 90 % uniformity with Advanced Surface Deposition (ASD) capabilities up to 10
  • Support Robot and AGV system. Customize layout to fit customer’s production line.
  • Unique jig free design reduces the chemical consumption & saves the maintenance cost
Downloads
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Plating Data Sheet
Contact us
Manz Asia
Manz Taiwan Ltd. 4F, No. 168-1, Zhongyuan Rd. 320021 Taoyuan City Taiwan
+886 3 4529811
info.tw@manz.com
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