The Key Technology to Achieve RDL Process — Plating
In the rapidly evolving semiconductor industry, PLP and TGV are gaining strong attention for enabling higher performance and efficiency. At the same time, rising demand for semiconductor testing is accelerating the need for high-yield production. The process depends on plating equipment, together with an in-line concentration analyzer and real-time data monitoring and control, to ensure consistent quality and meet stringent end-product requirements.
