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Cleaning, Developing, Etching, Stripping
Cleaning, Developing, Etching, Stripping
Manz Asia provides cleaning, development, etching, and stripping process equipment, primarily used in the production of semiconductor panel-level packaging (PLP), advanced IC substrates (glass substrates & probe card MLO), and displays.
Flexible Applications, Superior Results
With 40 years of experience handling various materials in photoresist processes, our expertise ensures high particle removal efficiency, precise photoresist patterning, selective material removal, high-accuracy pattern transfer, and complete elimination of residual photoresist. Our highly integrated continuous processing significantly boosts production efficiency and yield.
Our equipment applies to the following fields:
  • Display
  • Semiconductor FOPLP
  • IC substrate (Glass substrate and probe card MLO)
Our Capability
Semiconductor FOPLP IC Substrate Core IC Substrate TGV Probe Card MLO Display
Material EMC BT Glass BT Glass
L/S 2/2 µm 10/8 µm 2/2 µm 30/30 µm 2/2 µm
Substrate size max. 700 x 700 mm 510 x 515 mm 510 x 515 mm 355 x 400 mm max. 2940 x 3370 mm (G10.5)
Your Benefits
  • High-precision gear configuration reduces vibration during transmission.
  • Drying section after blow-drying to prevent oxidation of the conductive layer.
  • High-uniformity spray plate configuration achieves small line width and spacing.
  • Horizontal and vertical automated loading and unloading system
The Omni X Series integrates ECD (electrochemical deposition) and wet chemical process equipment. Comprising the Omni 310, Omni 510, and Omni 700 platforms, it supports FOPLP, IC substrates, and glass core applications across panel sizes ranging from 310 mm to 700 mm—from R&D to mass production.
Contact us
Manz Asia
Manz Taiwan Ltd. 4F, No. 168-1, Zhongyuan Rd. 320021 Taoyuan City Taiwan
+886 3 4529811
info.tw@manz.com
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