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Our Technologies
Products
Cleaning, Developing, Etching, Stripping
Manz offers cleaning, developing, etching, and stripping processes in wet chemistry, primarily applied in the production of high-end semiconductor panel-level packaging (PLP), IC substrate, and display.
Products
Desmear (DSM) & Plating Through Hole (PTH)
High aspect ratio HDI PCBs are utilized in AI servers, 5G servers, base stations, and low-orbit satellites, where high transmission capacity and the ability to carry higher current densities are essential.
Products
Plating
The key technology to achieve the RDL process in Panel Level Packaging and Through Glass Vias (TGV).
Products
Inkjet Printing
Inkjet printing technologies play a decisive role in the field of semiconductor IC packaging and offer numerous advantages. With our state-of-the-art printing systems, we enable increased flexibility in your production and significantly improve the environmental friendliness of your system.
Products
Automation
With several thousand installed robotic systems, Manz can look back on a long, successful history for automation solutions in the display and touch panel, solar and Li-ion battery industries. Manz has successfully transferred this know-how to numerous other industries and applications.
Contract Manufacturing
With innovative ideas, our expert teams with many years of know-how and our well-equipped production plants in Europe and Asia, we are today a leading high-tech partner for plant manufacturing, parts production and for assembly work for a large number of customers in a wide range of industries.
Discover our Contract Manufacturing Portfolio
Mechanical & Systems Engineering
Assembly & Clean Room Assembly
Parts Manufacturing
Contact us
Manz亞智科技
Manz Taiwan Ltd. 4F, No. 168-1, Zhongyuan Rd. 320021 Taoyuan City Taiwan
+886 3 4529811
info.tw@manz.com
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