Combining Manz Asia’s inkjet and manufacturing expertise with SUSS’ semiconductor process capabilities Driving next-generation inkjet solutions for advanced and panel-level packaging applications Accelerating the transition of inkjet technology toward high-volume semiconductor manufacturing Taoyuan, Taiwan, September 3, 2026 – A leading semiconductor advanced packaging equipment manufacturer, Manz Asia, today announced a strategic collaboration with SUSS, a leading manufacturer of equipment and process solutions for the semiconductor industry, to jointly advance next-generation inkjet solutions for semiconductor manufacturing and advanced packaging applications. As semiconductor manufacturing moves toward higher integration, more complex structures and larger-format processing, manufacturers are seeking greater process flexibility, material efficiency and manufacturing scalability. Inkjet printing is gaining increasing attention as an enabling technology to address these requirements. Compared with conventional coating approaches, inkjet technology enables precise and selective material deposition, reduces material consumption and can simplify process flows, creating new opportunities across advanced packaging and other high-value semiconductor manufacturing applications. A key focus of the collaboration will be to jointly explore new inkjet applications, validate materials and processes, and develop scalable manufacturing approaches. Manz Asia contributes proven inkjet capabilities, manufacturing engineering expertise and a strong position in the panel-level packaging ecosystem, supported by an end-to-end inkjet development platform and a Lab-to-Fab approach spanning material and substrate preparation, printing, curing and process characterization. SUSS brings deep semiconductor process expertise and global customer reach. Together, these complementary capabilities enable Manz Asia and SUSS to systematically evaluate and optimize processes, accelerate development and identify solutions tailored to specific semiconductor applications. The companies aim to shorten time-to-market and accelerate the transition of inkjet technology from advanced process development toward high-volume semiconductor manufacturing. "Successfully commercializing new semiconductor technologies requires deep process expertise, strong application know-how and close alignment with customer roadmaps. By combining SUSS' semiconductor process experience with Manz Asia's inkjet expertise, we can accelerate technology development and reduce time-to-market for future solutions. At the same time, the collaboration strengthens our access to the emerging panel-level packaging ecosystem, an area we believe will play an increasingly important role in next-generation semiconductor manufacturing. This partnership supports our Ambition 2030 strategy by strengthening our technology portfolio, expanding our capabilities in advanced packaging and increasing our exposure to attractive semiconductor growth markets", said Burkhardt Frick, CEO of SUSS. “Panel-level packaging is entering a new phase, driven by higher integration and increasingly complex structures. These developments are creating new demands for greater process flexibility, material efficiency and manufacturing scalability. Through our collaboration with SUSS, Manz Asia is combining its inkjet printing and manufacturing expertise with SUSS' semiconductor process capabilities and global customer reach. Together, we see strong potential to accelerate the transition of inkjet technology from advanced process development toward high-volume semiconductor manufacturing. This collaboration marks an important step toward delivering scalable, next-generation solutions for advanced packaging and future semiconductor applications,” said Robert Lin, CEO of Manz Asia. About Manz Asia Manz Asia delivers semiconductor equipment and solutions built on core technologies in Electrochemical Deposition (ECD), wet chemistry, digital printing, automation, and software integration. Our expertise covers advanced packaging (FOPLP / CoPoS) and IC substrate processing (glass and organic core), supporting customers from R&D to high-volume manufacturing. Through system solutions, contract manufacturing, and sales representation, we help customers accelerate time-to-market, boost yield, and stay competitive in the fast-evolving semiconductor industry. For more information, visit www.manz.com.tw About SUSS SUSS is a leading global provider of equipment and process solutions for the semiconductor industry. Focused on cutting-edge technology and precision engineering, we enable the production of next-generation microchips and semiconductor devices that power digital progress. Developed in close collaboration with research institutes and industry partners, our solutions fuel the AI and high-performance computing ecosystem and shape the future of intelligent devices and applications worldwide. Headquartered in Garching, Germany, SUSS has approximately 1,500 employees worldwide and recently generated sales of approximately €500 million. We operate production sites in Germany and Taiwan and development centers in Europe, Asia and the US, supported by a strong network of sales and service offices with close proximity to our customers. SUSS MicroTec SE is listed on the Frankfurt Stock Exchange (Prime Standard, FWB: SMHN; ISIN DE000A10K0235) and is part of the TecDAX and MDAX indices. For more information, visit www.suss.com. Contact: Manz Taiwan Ltd. Yvonne Huang Director of Marketing & Communications Phone: +886 3 452 9811 ext. 3399 E-Mail: yvonne.huang@manz.com

Enabling scalable RDL manufacturing for CoPoS, FOPLP and Glass Core TGV applications Taoyuan, Taiwan – August 18, 2026 – Manz Asia, a leading provider of semiconductor advanced packaging equipment and process solutions, has pioneered production-proven ECD (electrochemical deposition) platforms supporting 310 mm, 510 mm, and 700 mm panel formats. Building on ECD as a core technology, Manz Asia integrates key wet process tools—including cleaning, developing, etching, and stripping—into the Omni 310, Omni 510, and Omni 700 platforms to enable scalable panel-level RDL manufacturing. Extending RDL Process Value from Established Applications to Next-Generation Advanced Packaging As AI and advanced computing drive increasingly complex chiplet-based architectures, larger interposers and substrates are becoming essential to integrate more heterogeneous components within a single package. This evolution is accelerating the shift from 300 mm wafer-based manufacturing toward larger panel formats, while increasing the importance of RDL in enabling high-density interconnects across increasingly complex package architectures. With expertise spanning equipment and process integration, Manz Asia addresses evolving RDL manufacturing requirements by integrating ECD and key wet processes within a unified equipment portfolio. This approach helps manufacturers simplify process integration, reduce the complexity of managing multiple equipment suppliers, and gain greater flexibility across panel sizes and advanced packaging architectures. The Omni Series supports advanced packaging applications including FOPLP, CoPoS, and Glass Core TGV, with proven applications for PMIC and RF devices for communication and automotive markets. The platform also provides a foundation for continued technology development toward emerging AI and HPC packaging requirements. Glass Core TGV Process Enabling High-Performance Interconnects As Glass Core gains momentum in next-generation advanced packaging, TGV (Through-Glass Via) manufacturing requires precise glass micromachining, microvia formation, metallization, and high-aspect-ratio filling. Manz Asia is extending its etching and ECD technologies to address these requirements. Its glass etching equipment supports substrates up to 0.4 mm thick and microvias down to 20 μm, with TGV structures featuring aspect ratios of up to 1:20, enabling precise and controlled via formation. For TGV metallization, Manz Asia’s ECD technology supports high-aspect-ratio via filling and can be integrated with seed-layer sputtering and plating chemistry to enable void-free copper filling and uniform metal deposition. This integrated approach addresses critical requirements for fill quality, plating uniformity, and structural reliability in Glass Core TGV manufacturing. Advancing Panel-Level Packaging from Innovation to Production “AI-driven semiconductor growth is accelerating the evolution of advanced packaging, driving greater integration, larger package formats, and increasingly complex interconnect architectures,” said Robert Lin, CEO of Manz Asia. “RDL is becoming a critical enabling technology, connecting chips, interposers, substrates, and PCBs across emerging architectures such as CoPoS, FOPLP, and Glass Core TGV.” “Our 310 mm, 510 mm, and 700 mm production-proven RDL platforms reflect our commitment to scalable manufacturing across diverse package architectures and substrate formats,” Lin continued. “With a broad portfolio covering most of the key process steps in RDL manufacturing, Manz Asia enables customers to streamline supplier coordination, simplify process integration, and deploy more efficient production solutions.” “Manz Asia’s role goes beyond equipment delivery. We work closely with customers to bridge the gap between process innovation and high-volume manufacturing, with a focus on productivity, yield, and cost performance. By combining process expertise, equipment integration, and continuous innovation, we aim to accelerate the adoption of panel-level packaging and contribute to a more robust advanced packaging ecosystem for the AI era.” ▲Manz Asia Omni Series – ECD and Wet Process Platform for Scalable Panel-Level RDL Manufacturing About Manz Asia Manz Asia delivers semiconductor equipment and solutions built on core technologies in Electrochemical Deposition (ECD), wet chemistry, digital printing, automation, and software integration. Our expertise covers advanced packaging (FOPLP / CoPoS) and IC substrate processing (glass and organic core), supporting customers from R&D to high-volume manufacturing. Through system solutions, contract manufacturing, and sales representation, we help customers accelerate time-to-market, boost yield, and stay competitive in the fast-evolving semiconductor industry. www.manz.com.tw/en

World’s first 310mm × 310mm panel-level packaging (PLP) Electrochemical Deposition (ECD) production system delivered to customer line Omni X-series covering 310mm, 510mm, and 700mm platforms, enabling a broad range of panel-level manufacturing applications. Supports FOPLP, CoPoS, and TGV applications for AI, HPC, and advanced memory markets Taoyuan, Taiwan, June 15, 2026 – A leading semiconductor advanced packaging equipment manufacturer, Manz Asia, has successfully delivered the world’s first 310mm × 310mm panel-level packaging (PLP) Electrochemical Deposition (ECD) mass production system. The system expands Manz Asia’s advanced packaging portfolio and showcases its integrated in-house expertise in process innovation, equipment engineering, and high-volume manufacturing. The new ECD platform is designed with high flexibility to support both glass and metal square carriers and integrates wet chemical process modules for Redistribution Layer (RDL) fabrication. It is engineered for FOPLP-, CoPoS-, and TGV-based advanced packaging architectures. The 310mm × 310mm format offers advantages in scalability, panel utilization, and production yield, positioning it as a key enabling technology for panel-level packaging to support AI, high-performance computing (HPC), high-bandwidth memory (HBM), and high-speed interconnect applications. Advanced packaging is increasingly converging with leading-edge semiconductor process technologies, with manufacturing capacity progressively concentrated in Taiwan. This shift is accelerating integration across process nodes and packaging architectures in the global semiconductor supply chain. Leveraging strong in-house R&D capabilities and close collaboration with leading IDM and packaging customers, Manz Asia continues to accelerate technology iteration and volume production deployment, strengthening its position in the global panel-level packaging equipment ecosystem. The ECD system seamlessly integrates a full suite of wet chemical process modules, including cleaning, developing, etching, and stripping, and supports both spin and spray processing modes, creating a comprehensive 310mm × 310mm panel-level RDL manufacturing solution under the “Omni 310” platform. The Omni X-series now spans Omni 310 (310mm × 310mm), Omni 510 (510mm × 515mm), and Omni 700 (700mm × 700mm), forming a scalable platform architecture for panel-level mass production. The modular system design enables flexible configuration across different device architectures, process flows, and production capacity requirements, supporting development, qualification, pilot production, and high-volume manufacturing. It strengthens Manz Asia’s competitiveness in the global advanced packaging equipment market. Robert Lin, CEO of Manz Asia, said the successful deployment of the Omni 310 into customer production lines reflects growing market demand for advanced packaging platforms that combine flexibility with production readiness. “As advanced packaging becomes increasingly central to AI and high-performance computing (HPC) architectures, capabilities such as process control, scalability, and seamless integration into high-volume manufacturing environments have become key competitive differentiators,” he said. He added that Manz Asia will continue to advance its technology roadmap as a global-class equipment supplier, further strengthening its integration of ECD and wet chemical process technologies to improve manufacturing efficiency, yield stability, and production ramp-up. “We aim to accelerate the deployment of next-generation packaging technologies in FOPLP, CoPoS, and TGV, while reinforcing supply chain resilience across the semiconductor ecosystem,” he said. “Through a multi-platform strategy spanning 310mm, 510mm, and 700mm, we provide a consistent technology pathway from process development to high-volume manufacturing, enabling customers to scale efficiently and predictably. The Omni X-series roadmap is designed to support sustainable and scalable capacity expansion for next-generation semiconductor packaging applications.” ▲ Manz Asia World’s First 310mm × 310mm Panel-Level Packaging ECD Production System About Manz Asia Manz Asia delivers semiconductor equipment and solutions built on core technologies in Electrochemical Deposition (ECD), wet chemistry, digital printing, automation, and software integration. Our expertise covers advanced packaging (FOPLP / CoPoS) and IC substrate processing (glass and organic core), supporting customers from R&D to high-volume manufacturing. Through system solutions, contract manufacturing, and sales representation, we help customers accelerate time-to-market, boost yield, and stay competitive in the fast-evolving semiconductor industry. www.manz.com.tw/en Contact: Manz Taiwan Ltd. Yvonne Huang Director Marketing & Communications Phone: +886 3 452 9811 ext. 3399 E-Mail: yvonne.huang@manz.com

Joint Lab-to-Fab inkjet equipment combines Epson’s precision printhead technology with Manz Asia’s equipment and process expertise to enable scalable manufacturing Taoyuan, Taiwan — March 12, 2026 — A leading semiconductor advanced packaging equipment manufacturer Manz Asia today announced a strategic partnership with Seiko Epson Corporation (Epson) aimed at accelerating the adoption of advanced inkjet technology in semiconductor manufacturing. The collaboration combines Manz Asia’s expertise in semiconductor equipment engineering, process integration, and intelligent software systems with Epson’s industry-leading inkjet printhead technology. By bringing together these complementary capabilities, the two companies are developing scalable Lab-to-Fab inkjet equipment designed to support next-generation semiconductor manufacturing applications. The jointly developed inkjet equipment is available as a series of systems covering R&D, pilot production, and mass manufacturing, enabling semiconductor manufacturers to expand applications, validate materials efficiently, optimize process parameters, and scale seamlessly from development to high-volume production. Manz Asia’s inkjet system solutions with high compatibility features enable precise 2D and 3D printing of conductive, photoresist, and specialized functional inks on a variety of products, components, and surfaces. The systems are well-suited for key semiconductor processes, including patterning 2.5D/3D antenna traces, heatsink layers, and bonding layers for RFIC, PMIC, and CPO devices. All of these applications can be handled with Manz Asia inkjet system solutions, providing flexible, scalable, and cost-effective solutions for advanced packaging and emerging device architectures. Robert Lin, CEO of Manz Asia, said: “Inkjet technology is transforming semiconductor manufacturing. Together with Epson, we are delivering precise and scalable inkjet equipment solutions that enable manufacturers to validate processes and scale from R&D to high-volume production. Our Taiwan R&D center serves as an open innovation hub, uniting materials partners, printhead providers, and key suppliers, turning innovative concepts into practical manufacturing outcomes and helping customers achieve faster time-to-market and improved production efficiency.” Shunya Fukuda, COO of Epson’s IJS Operations Division, added: “Digital additive manufacturing using inkjet technology is expected to become a key technology supporting the evolution of semiconductor packaging. By leveraging Epson’s high-precision droplet control technology and volume production know-how developed, we works together with Manz Asia to build a scalable manufacturing platform bridging laboratory development and volume production. Through this initiative, Epson aims to contribute to the sustainable development of the semiconductor industry.” This collaboration marks a step toward more flexible, efficient, and sustainable semiconductor production, leveraging complementary core technologies to deliver long-term differentiation and measurable value to global customers. Picture 1: RDJet100 ─ a laboratory equipment for validating new functional inks and substrates in semiconductor advanced packaging metallization process. Powered by Epson printhead. Picture 2: ICJet series ─ Industrial production equipment for frontend and backend semiconductor processes, supporting wafer and panel substrates. Picture 3: Manz Asia and Epson have teamed to deliver inkjet system solutions for semiconductor processes—2.5D/3D antennas traces, heatsinks, and bonding layers for RFIC/PMIC/CPO—enabling transformative production advances. About Manz Asia Manz Asia delivers semiconductor equipment and solutions built on core technologies in wet chemistry, plating, inkjet printing, automation, and software integration. Our expertise covers advanced packaging (High-Density PLP / FOPLP) and IC substrate processing (glass and organic core), supporting customers from R&D to high-volume manufacturing. Through system solutions, contract manufacturing, and sales representation, we help customers accelerate time-to-market, boost yield, and stay competitive in the fast-evolving semiconductor industry. www.manz.com.tw/en About SEIKO EPSON Epson is a global technology leader whose philosophy of efficient, compact, and precise innovation enriches lives and helps create a better world. Epson is focused on solving societal challenges through innovations in printing, manufacturing, and visual technologies, with the goal of becoming carbon negative and eliminating the use of exhaustible underground resources by 2050.Led by Seiko Epson Corporation, the Epson Group generates annual sales of more than JPY 1 trillion. corporate.epson/en/ Contact: Manz Taiwan Ltd. Yvonne Huang Director Marketing & Communications Phone: +886 3 452 9811 ext. 3399 E-Mail: yvonne.huang@manz.com

Taoyuan, Taiwan, Feb. 23rd 2026 –  XTPL (WSE:XTP), a developer of Ultra-Precise Dispensing (UPD) technology for nanomaterial deposition, has entered a strategic partnership with Manz Asia to support the development and commercialization of advanced semiconductor packaging applications. Under the partnership, XTPL will install a Delta Printing System in Manz Asia’s  Semiconductor Innovation and R&D centre in Taoyuan, Taiwan, establishing a local capability for process development, testing, and validation. The facility will enable customers to evaluate specific applications and establish a pathway from prototype development to volume production. The partnership combines XTPL’s proprietary dispensing technology with Manz Asia’s expertise in advanced semiconductor manufacturing systems and process development. The collaboration will focus on joint engagement with third-party customers and the evaluation of application-specific commercial opportunities. XTPL’s UPD technology enables highly controlled deposition of functional nanomaterials with feature sizes ranging from tens of micrometres down to below one micrometre. The technology is already qualified for high-volume production in display applications and is currently being evaluated for additional applications in advanced electronics, including inline manufacturing, multichip module packaging, and advanced electronic structures. “I am delighted to start the partnership with Manz Asia - a company with a strong position and deep expertise in the semiconductor industry in Taiwan and Asia. It is only natural for us to work side by side with a partner who knows this ecosystem from the inside. The synergy between XTPL's unique ultra-precise dispensing technology and Manz Asia's competencies in advanced semiconductor packaging is a natural fit. That is precisely why I am confident this collaboration will translate into tangible business opportunities for both sides.,” said Filip Granek, CEO of XTPL. Robert Lin, CEO of Manz Asia, added: “This strategic partnership with XTPL expands our printing capabilities into ultra-precise material deposition, enabling a wide range of advanced semiconductor applications. The technology supports both conductive and non-conductive materials across 2D, 2.5D and 3D substrates in diverse manufacturing scenarios. By combining XTPL’s dispensing technology with Manz’s automation and process integration expertise, we broaden our portfolio and provide more flexible manufacturing solutions, helping customers accelerate innovation and move efficiently from prototype to volume production.” XTPL and Manz Asia partner to accelerate adoption of ultra-precise dispensing technology in Asia. About Manz Asia Manz Asia delivers semiconductor equipment and integrated solutions built on core technologies in wet chemistry, plating, digital printing, automation, and software integration. The company’s expertise spans advanced packaging, including high-density PLP/FOPLP, and IC substrate processing for both glass and organic core architectures. Supporting customers from R&D through high-volume manufacturing, Manz Asia helps accelerate time-to-market, improve yield performance, and enhance competitiveness in the rapidly evolving semiconductor industry. To find out more, go to: www.manz.com.tw/en About XTPL XTPL S.A. (WSE:XTP) develops and commercializes solutions based on its proprietary Ultra-Precise Dispensing (UPD) technology, enabling highly controlled deposition of functional nanomaterials with feature sizes from below 1 µm to over 50 µm. The technology is applicable to advanced electronics markets including semiconductors, displays, RDL, multichip modules, and advanced PCB applications, and is already qualified for high-volume commercial production in display manufacturing. Since 2019, XTPL S.A. has been listed on the Main Market of the Warsaw Stock Exchange, and since 2020 it has also been listed on the Open Market in Frankfurt. To find out more, go to: www.xtpl.com Contact: Manz Taiwan Ltd. Yvonne Huang   |   Director Marketing & Communications Phone: +886 3 452 9811 ext. 3399 E-Mail: yvonne.huang@manz.com

05/20/2025 16:15:00 CEST Driving Panel-Level Packaging Advancements with New R&D Center and Strategic Expansion in Asia   Manz Asia, a global leader in semiconductor panel-level packaging equipment, is accelerating the mass production and commercialization of CoPoS (Chip-on-Panel-on-Substrate) technology. Leveraging nearly four decades of expertise in synchronized performance across wet processing, plating, and fully integrated automation, Manz Asia enables advancements in takt time, throughput, and uniformity—driving the industry's transition to panel-level packaging, a critical enabler for improving productivity and accommodating larger chip packaging demands.   With deep roots in the PCB, IC substrate, and display industries, Manz Asia has strategically expanded its focus into semiconductor advanced packaging. The introduction of CoPoS — the panelized evolution of CoWoS technology — has now become a widely recognized standard across the industry, helping drive the transformation from round to square packaging formats for next-generation devices.   Recognizing the pivotal role of redistribution layer (RDL) performance in conductivity, stability, and yield for CoPoS, Manz Asia has developed the latest highly specialized etching and plating equipment tailored to support various packaging structures and substrate types. In parallel, the company's commitment to green manufacturing and smart production practices is exemplified by its development of inkjet printing equipment, enables maskless, precise material deposition on substrates like PI, ABF, EMC, silicon, and glass. This simplifies metallization, boosting efficiency, sustainability, yield, and flexibility in semiconductor manufacturing.     Manz Asia sets up a Semiconductor Innovation and R&D Center in Taiwan to support equipment development, process validation, and customer sample projects.   To further accelerate innovation, Manz Asia has established a dedicated Semiconductor Innovation R&D Center, equipped with key Redistribution Layer (RDL) and metallization process equipment. This facility supports both experimental development and mass production validation, playing a vital role in optimizing process integration, system implementation, and overall production line efficiency. Through close collaboration with customers, the center enables faster commercialization of next-generation semiconductor packaging technologies.   "By establishing our R&D center, we are not only advancing CoPoS technologies but also reinforcing our leading position in the advanced panel-level packaging field," said Robert Lin, General Manager at Manz Asia. "At the same time, to meet the growing demand in advanced packaging, Manz Asia completed the purchasing agreement of Manz AG’s semiconductor-focused legal entity in Asia during Q2 2025. This strategic move strengthens our operational foundation, expands our regional footprint, and enhances our ability to support localized supply chains, delivering faster and more flexible service to customers worldwide."   Looking ahead, Manz Asia remains firmly committed to driving innovation in semiconductor packaging equipment. By collaborating closely with customers and industry partners, the company aims to deliver increasingly efficient, competitive, and sustainable solutions that address the evolving needs of the global semiconductor industry.     Manz Asia General Manager Robert Lin (left) and Manz AG Representative Martin Mucha (right) sign the purchasing agreement.   For the latest capabilities of Manz CoPoS solutions and inkjet printing equipment with live demo, visit us at SEMICON SEA 2025, booth #L1314. We warmly welcome you to explore our newest performance advancements.   About Manz AsiaManz Asia is a leading manufacturer of advanced semiconductor equipment, driving technological innovation and process excellence within the CoPoS (CoWoS panelization) technology framework for panel-level packaging.   From laboratory and pilot production to small-series and mass production, Manz provides comprehensive equipment solutions for wet chemistry, plating, digital printing, automation, and proprietary software integration, meeting the Redistribution Layer (RDL) process requirements. These technologies are widely applied in Fan-Out Panel-Level Packaging (FOPLP), Through Glass Via (TGV), and IC substrates, addressing every stage of semiconductor packaging manufacturing.   By enhancing production efficiency, optimizing process quality, and strengthening market competitiveness, Manz Asia empowers the semiconductor industry to achieve higher standards of excellence.   Contact: Manz Asia Marketing & Communications Director Yvonne Huang +886 3 452 9811 yvonne.huang@manz.com

02/28/2025 16:51:00 CET, Reutlingen   Reutlingen, 28 February 2025 – The insolvency administrator of Manz AG, attorney Mr. Martin Mucha, and Mr. Robert Lin, General Manager of Manz China and Manz Taiwan, signed a purchase agreement today, 28 February 2025, for the acquisition of the Manz Asia sub-group by Mr. Lin. The proceeds from the sale will go to the insolvency estate of Manz AG. The purchase price remains confidential.   The sub-group Manz Asia Ltd., headquartered in Hong Kong (PR China), includes the subsidiaries Manz China Suzhou Ltd (Suzhou, PR China), Manz Chungli Ltd. (Chungli, Taiwan), Manz Taiwan Ltd (Chungli, Taiwan) and Manz India Private Ltd. (New Delhi, India). The companies in Taiwan and PR China serve as production, development, sales, and service locations of Manz group, while customers in India are locally supported with sales and service offerings.   Manz’s Asian business focuses on manufacturing equipment for semiconductor production, including the FOPLP process (Panel Level Packaging) and innovative digital printing solutions, meeting the increasing demands for performance and efficiency in the rapidly growing semiconductor industry. Additionally, contract manufacturing is provided for renowned clients. Proximity to customers is crucial given the high complexity of manufacturing processes.   Mr. Robert Lin has been with Manz since 15 years and served as General Manager of Manz China and Manz Taiwan. Under his leadership, a dedicated sales team and a more defined market presence were established, significantly increasing market visibility.   With the management buy-out, the foundation for the company’s continued development is now in place. In his new role as an investor, Mr. Robert Lin will take over all approximately 380 Manz employees in the Asia region and plans to further expand the existing strategic direction. The purchase will be backed by strong investors with long term experience in the semiconductor industry. This will secure the necessary funds for the future growth strategy of Manz Asia.   Insolvency administrator Martin Mucha expressed satisfaction with the sale to the experienced Manz manager: “Mr. Robert Lin has the full trust of the Manz AG Management Board. We are confident that the Asian business is in excellent hands with Mr. Lin and his team.”  

12/23/2024 17:05:00 CET, Reutlingen The German high-tech engineering company Manz AG, based in Reutlingen, has filed for insolvency proceedings at the Stuttgart District Court. By order of December 20, 2024, attorney Martin Mucha of the Germany-wide law firm GRUB BRUGGER was appointed as the preliminary insolvency administrator.   Manz AG, a high-tech mechanical engineering company, develops best-in-class production solutions for lithium-ion batteries and electronic components and devices for its customers in the automotive and e-mobility, electronics, energy and battery manufacturing sectors. In view of the original market expectations for e-mobility, the company built up expertise at an early stage and invested in the expansion of capacities and technologies, particularly for battery cell production. Particularly in Europe, the expected market potential has not materialized as expected, with major international manufacturers postponing or canceling investments. For Manz, this meant that the high investments in technology and innovations could not be offset by corresponding revenues. In the coming days, a structured process will be launched that includes both the examination of a restructuring concept and the possible sale of parts of the company. Manz currently employs around 1,200 people worldwide, with around 400 employees at the German site. Revenues of around €170 to 180 million are planned for the current fiscal year. “I have informed the staff immediately about the insolvency application and announced that business operations will continue. Currently, I am getting an overview of the situation in the company together with my team,” explains the experienced restructuring expert Martin Mucha, who was appointed as the provisional insolvency administrator by the Local Court of Stuttgart.  

11/10/2023 10:00:00 CET, Reutlingen Presentation of the comprehensive range of production solutions for the automotive industry in Hall B2, booth 225 | Unique in the world: FOPLP RDL panel with a process area of 700 x 700 millimeters | Demonstration of the Battery Laser System BLS 500 for various laser processes in the production of electric powertrain components.   Manz AG, a global high-tech equipment manufacturer with an extensive technology portfolio, shows its comprehensive portfolio of production solutions for the automotive industry at Productronica in Munich from 14 to 17 November 2023 in Hall B2, booth 225. The focus will be on solutions for semiconductor production and laser processes, such as those used in the production of lithium-ion batteries and other components of the electric powertrain.   Production equipment for European semiconductor manufacturing   The highlight at the Manz booth is the presentation of the world's largest FOPLP Redistribution Layer (RDL) panel with a process area of 700 x 700 millimeters, manufactured on Manz production equipment. For the set-up of FOPLP RDL production lines, Manz AG benefits from its many years of experience in the fields of wet chemistry, automation, metrology and inspection technologies.   Manz is specialized in the realization of advanced interconnect applications (IC) in the field of semiconductor production. These connections are crucial for communication between components and have a significant influence on the performance and speed of a microchip. The more densely the ever-smaller chips are packed together, the more interconnect layers are required to integrate all the chips.   Manz supplies equipment for lithography and electroplating that fulfils the critical process requirements for high-density redistribution layers (RDL). The portfolio includes both stand-alone equipment and fully integrated solutions to produce circuit patterns on substrates and other electronic interconnect systems.   The use of the innovative production equipment will significantly increase the production capacities of Manz's customers and the IC substrates manufactured on the equipment. This gives customers from the automotive industry a clear competitive advantage and enables them to fulfil the market's continuing demand for ever more powerful, lighter, thinner, and better electronic components.   In addition to production equipment, Manz offers its customers "Total Fab Planning", which covers all development steps from customized process development and equipment construction to the integration of upstream and downstream production lines.   BLS 500 – Control laser processes safely and stably   Another highlight at Productronica is the presentation of the Battery Laser System BLS 500, a flexible laser platform that enables Manz customers to quickly and stably master the laser processes required in the production of lithium-ion batteries and other components of the electric powertrain. The portfolio includes innovative laser technologies and processes such as zero-gap welding, laser cutting, partial ablation of materials and coatings as well as bimetal welding or laser tab welding for an optimized welding process of cell arresters.   "The Productronica is an exciting platform for us to present our broad and proven portfolio for the automotive industry. We are one of the leading suppliers in the field of laser technology. However, the European semiconductor market also harbors great potential for us following the recently announced investment plans. With our production technology for FOPLP-RDL panels developed and tested in Asia, we now also want to score points on the European market," says Axel Bartmann, Director Marketing & Corporate Communications at Manz AG.   Images – all rights reserved by Manz AG     Unique in the world: FOPLP redistribution layer (RDL) panel with a process area of 700 x 700 millimeters.     The BLS 500 from Manz AG for various laser processes.