05/20/2025 16:15:00 CEST Driving Panel-Level Packaging Advancements with New R&D Center and Strategic Expansion in Asia   Manz Asia, a global leader in semiconductor panel-level packaging equipment, is accelerating the mass production and commercialization of CoPoS (Chip-on-Panel-on-Substrate) technology. Leveraging nearly four decades of expertise in synchronized performance across wet processing, plating, and fully integrated automation, Manz Asia enables advancements in takt time, throughput, and uniformity—driving the industry's transition to panel-level packaging, a critical enabler for improving productivity and accommodating larger chip packaging demands.   With deep roots in the PCB, IC substrate, and display industries, Manz Asia has strategically expanded its focus into semiconductor advanced packaging. The introduction of CoPoS — the panelized evolution of CoWoS technology — has now become a widely recognized standard across the industry, helping drive the transformation from round to square packaging formats for next-generation devices.   Recognizing the pivotal role of redistribution layer (RDL) performance in conductivity, stability, and yield for CoPoS, Manz Asia has developed the latest highly specialized etching and plating equipment tailored to support various packaging structures and substrate types. In parallel, the company's commitment to green manufacturing and smart production practices is exemplified by its development of inkjet printing equipment, enables maskless, precise material deposition on substrates like PI, ABF, EMC, silicon, and glass. This simplifies metallization, boosting efficiency, sustainability, yield, and flexibility in semiconductor manufacturing.     Manz Asia sets up a Semiconductor Innovation and R&D Center in Taiwan to support equipment development, process validation, and customer sample projects.   To further accelerate innovation, Manz Asia has established a dedicated Semiconductor Innovation R&D Center, equipped with key Redistribution Layer (RDL) and metallization process equipment. This facility supports both experimental development and mass production validation, playing a vital role in optimizing process integration, system implementation, and overall production line efficiency. Through close collaboration with customers, the center enables faster commercialization of next-generation semiconductor packaging technologies.   "By establishing our R&D center, we are not only advancing CoPoS technologies but also reinforcing our leading position in the advanced panel-level packaging field," said Robert Lin, General Manager at Manz Asia. "At the same time, to meet the growing demand in advanced packaging, Manz Asia completed the purchasing agreement of Manz AG’s semiconductor-focused legal entity in Asia during Q2 2025. This strategic move strengthens our operational foundation, expands our regional footprint, and enhances our ability to support localized supply chains, delivering faster and more flexible service to customers worldwide."   Looking ahead, Manz Asia remains firmly committed to driving innovation in semiconductor packaging equipment. By collaborating closely with customers and industry partners, the company aims to deliver increasingly efficient, competitive, and sustainable solutions that address the evolving needs of the global semiconductor industry.     Manz Asia General Manager Robert Lin (left) and Manz AG Representative Martin Mucha (right) sign the purchasing agreement.   For the latest capabilities of Manz CoPoS solutions and inkjet printing equipment with live demo, visit us at SEMICON SEA 2025, booth #L1314. We warmly welcome you to explore our newest performance advancements.   About Manz AsiaManz Asia is a leading manufacturer of advanced semiconductor equipment, driving technological innovation and process excellence within the CoPoS (CoWoS panelization) technology framework for panel-level packaging.   From laboratory and pilot production to small-series and mass production, Manz provides comprehensive equipment solutions for wet chemistry, plating, digital printing, automation, and proprietary software integration, meeting the Redistribution Layer (RDL) process requirements. These technologies are widely applied in Fan-Out Panel-Level Packaging (FOPLP), Through Glass Via (TGV), and IC substrates, addressing every stage of semiconductor packaging manufacturing.   By enhancing production efficiency, optimizing process quality, and strengthening market competitiveness, Manz Asia empowers the semiconductor industry to achieve higher standards of excellence.   Contact: Manz Asia Marketing & Communications Director Yvonne Huang +886 3 452 9811 yvonne.huang@manz.com

02/28/2025 16:51:00 CET, Reutlingen   Reutlingen, 28 February 2025 – The insolvency administrator of Manz AG, attorney Mr. Martin Mucha, and Mr. Robert Lin, General Manager of Manz China and Manz Taiwan, signed a purchase agreement today, 28 February 2025, for the acquisition of the Manz Asia sub-group by Mr. Lin. The proceeds from the sale will go to the insolvency estate of Manz AG. The purchase price remains confidential.   The sub-group Manz Asia Ltd., headquartered in Hong Kong (PR China), includes the subsidiaries Manz China Suzhou Ltd (Suzhou, PR China), Manz Chungli Ltd. (Chungli, Taiwan), Manz Taiwan Ltd (Chungli, Taiwan) and Manz India Private Ltd. (New Delhi, India). The companies in Taiwan and PR China serve as production, development, sales, and service locations of Manz group, while customers in India are locally supported with sales and service offerings.   Manz’s Asian business focuses on manufacturing equipment for semiconductor production, including the FOPLP process (Panel Level Packaging) and innovative digital printing solutions, meeting the increasing demands for performance and efficiency in the rapidly growing semiconductor industry. Additionally, contract manufacturing is provided for renowned clients. Proximity to customers is crucial given the high complexity of manufacturing processes.   Mr. Robert Lin has been with Manz since 15 years and served as General Manager of Manz China and Manz Taiwan. Under his leadership, a dedicated sales team and a more defined market presence were established, significantly increasing market visibility.   With the management buy-out, the foundation for the company’s continued development is now in place. In his new role as an investor, Mr. Robert Lin will take over all approximately 380 Manz employees in the Asia region and plans to further expand the existing strategic direction. The purchase will be backed by strong investors with long term experience in the semiconductor industry. This will secure the necessary funds for the future growth strategy of Manz Asia.   Insolvency administrator Martin Mucha expressed satisfaction with the sale to the experienced Manz manager: “Mr. Robert Lin has the full trust of the Manz AG Management Board. We are confident that the Asian business is in excellent hands with Mr. Lin and his team.”  

12/23/2024 17:05:00 CET, Reutlingen The German high-tech engineering company Manz AG, based in Reutlingen, has filed for insolvency proceedings at the Stuttgart District Court. By order of December 20, 2024, attorney Martin Mucha of the Germany-wide law firm GRUB BRUGGER was appointed as the preliminary insolvency administrator.   Manz AG, a high-tech mechanical engineering company, develops best-in-class production solutions for lithium-ion batteries and electronic components and devices for its customers in the automotive and e-mobility, electronics, energy and battery manufacturing sectors. In view of the original market expectations for e-mobility, the company built up expertise at an early stage and invested in the expansion of capacities and technologies, particularly for battery cell production. Particularly in Europe, the expected market potential has not materialized as expected, with major international manufacturers postponing or canceling investments. For Manz, this meant that the high investments in technology and innovations could not be offset by corresponding revenues. In the coming days, a structured process will be launched that includes both the examination of a restructuring concept and the possible sale of parts of the company. Manz currently employs around 1,200 people worldwide, with around 400 employees at the German site. Revenues of around €170 to 180 million are planned for the current fiscal year. “I have informed the staff immediately about the insolvency application and announced that business operations will continue. Currently, I am getting an overview of the situation in the company together with my team,” explains the experienced restructuring expert Martin Mucha, who was appointed as the provisional insolvency administrator by the Local Court of Stuttgart.  

11/10/2023 10:00:00 CET, Reutlingen Presentation of the comprehensive range of production solutions for the automotive industry in Hall B2, booth 225 | Unique in the world: FOPLP RDL panel with a process area of 700 x 700 millimeters | Demonstration of the Battery Laser System BLS 500 for various laser processes in the production of electric powertrain components.   Manz AG, a global high-tech equipment manufacturer with an extensive technology portfolio, shows its comprehensive portfolio of production solutions for the automotive industry at Productronica in Munich from 14 to 17 November 2023 in Hall B2, booth 225. The focus will be on solutions for semiconductor production and laser processes, such as those used in the production of lithium-ion batteries and other components of the electric powertrain.   Production equipment for European semiconductor manufacturing   The highlight at the Manz booth is the presentation of the world's largest FOPLP Redistribution Layer (RDL) panel with a process area of 700 x 700 millimeters, manufactured on Manz production equipment. For the set-up of FOPLP RDL production lines, Manz AG benefits from its many years of experience in the fields of wet chemistry, automation, metrology and inspection technologies.   Manz is specialized in the realization of advanced interconnect applications (IC) in the field of semiconductor production. These connections are crucial for communication between components and have a significant influence on the performance and speed of a microchip. The more densely the ever-smaller chips are packed together, the more interconnect layers are required to integrate all the chips.   Manz supplies equipment for lithography and electroplating that fulfils the critical process requirements for high-density redistribution layers (RDL). The portfolio includes both stand-alone equipment and fully integrated solutions to produce circuit patterns on substrates and other electronic interconnect systems.   The use of the innovative production equipment will significantly increase the production capacities of Manz's customers and the IC substrates manufactured on the equipment. This gives customers from the automotive industry a clear competitive advantage and enables them to fulfil the market's continuing demand for ever more powerful, lighter, thinner, and better electronic components.   In addition to production equipment, Manz offers its customers "Total Fab Planning", which covers all development steps from customized process development and equipment construction to the integration of upstream and downstream production lines.   BLS 500 – Control laser processes safely and stably   Another highlight at Productronica is the presentation of the Battery Laser System BLS 500, a flexible laser platform that enables Manz customers to quickly and stably master the laser processes required in the production of lithium-ion batteries and other components of the electric powertrain. The portfolio includes innovative laser technologies and processes such as zero-gap welding, laser cutting, partial ablation of materials and coatings as well as bimetal welding or laser tab welding for an optimized welding process of cell arresters.   "The Productronica is an exciting platform for us to present our broad and proven portfolio for the automotive industry. We are one of the leading suppliers in the field of laser technology. However, the European semiconductor market also harbors great potential for us following the recently announced investment plans. With our production technology for FOPLP-RDL panels developed and tested in Asia, we now also want to score points on the European market," says Axel Bartmann, Director Marketing & Corporate Communications at Manz AG.   Images – all rights reserved by Manz AG     Unique in the world: FOPLP redistribution layer (RDL) panel with a process area of 700 x 700 millimeters.     The BLS 500 from Manz AG for various laser processes.  

01/18/2022 09:00:00 CET, Reutlingen Order from a leading manufacturer of semiconductors worth around USD 20 million | Massive market growth in the chip industry driven by global megatrends such as IoT and digitalization as well as electromobility and autonomous driving | Order will affect revenues and earnings in equal parts in 2022 and 2023   Manz AG, a globally active high-tech equipment manufacturer with a comprehensive technology portfolio, is facing continued interest in its high-tech manufacturing equipment in the new year. For example, Manz has received an order worth around USD 20 million from a leading producer of semiconductors, which will affect revenues and earnings in roughly equal parts in 2022 and 2023.   For chip production, Manz AG's new customer relies on the innovative Fan-Out Panel Level Packaging (FOPLP) process. For the realization of FOPLP with simultaneous coating of the microchips with an additional metal layer to further optimize the performance parameters of the chips (redistribution layer), Manz is the world's only provider of turnkey production lines. As a result, the company has established an exposed position in this growth market in various customer projects over the past few years. In order to realize increasing miniaturization, i.e. ever smaller components with ever greater performance, Fan-Out Panel Level Packaging plays a decisive role. In addition to a significant reduction in volume, thickness, weight, and manufacturing costs of the packaging while doubling the number of pins, the process also has significantly positive effects on the thermal conductivity and speed of the components.   “The number of chips required is rising sharply across industries. This dynamic will continue to intensify, most notably in the automotive industry, for example, due to the megatrends of electromobility and autonomous driving,” comments Martin Drasch, CEO of Manz AG. “In order to enable increasing digitization, miniaturization is a basic prerequisite – that is, the performance of components increases while their size decreases and costs can be significantly reduced at the same time. Manz's equipment has a crucial role to play here: thanks to our comprehensive expertise in all aspects of Fan-Out Panel Level Packaging, we can significantly reduce the volume, thickness, weight, and manufacturing costs of chip packaging – to the benefit of our customers.”  

11/16/2021 10:00:00 CET, Reutlingen Minority investment in Q.big 3D, a specialist in innovative additive manufacturing processes, completed | Partnership expands expertise to include 3D printing to provide customers with fast, flexible, and cost-effective part manufacturing and sampling services | Investment of Manz AG in the lower single-digit million euro range   Manz AG, a globally active high-tech equipment manufacturer with a comprehensive technology portfolio, is acquiring a stake in Q.big 3D, a specialist in the printing of large components using innovative additive manufacturing processes. Through this investment, Manz AG is further expanding its technology portfolio as part of its M&A strategy and is acquiring expertise in a promising future industry.   Q.big 3D is a specialist in the 3D printing of large components. The specially developed technology enables components to be manufactured up to forty times faster than alternative processes, with comparably fine surface structures. This is made possible by the flexibly adjustable nozzle design, which enables both fast, large-volume printing and the application of fine surfaces and structures to the same component. Thus, the process offers advantages over other established 3D printing technologies in terms of printing speed, material costs, surface quality and the possible component sizes. In particular, the use of plastic granulate significantly reduces material costs and also allows serial products as well as prototypes with near-series product characteristics. Manz AG is now combining this know-how with its own decades of industrialization expertise and will thus be able to provide its customers with even more comprehensive production solutions in the future.   Martin Drasch, CEO of Manz AG, comments: "By partnering with Q.big 3D, we are further expanding our technology and competence portfolio. Following our investment in CADIS Engineering GmbH, a specialist for industrial inkjet systems, this is now the next step in order to be able to offer our customers, particularly from the automotive industry, an even more comprehensive service portfolio in the future, for example in the course of prototype production of battery modules or for sampling for pre-series developments. We are also strengthening our Contract Manufacturing segment with this deal, as the innovative technology of Q.big 3D enables us to produce special parts for our customers on a large scale significantly faster and more cost-effectively than before."   Company Profile:   Manz AG – engineering tomorrow’s production   Manz AG is a globally active high-tech engineering company.   With a focus on the automotive industry and electromobility, battery production, electronics, energy, and medical technology, Manz develops and builds innovative and efficient production solutions: From customized single machines for laboratory production or pilot and small series production, to standardized modules and systems, to turnkey lines for mass production.   Technologically, Manz's production equipment is based on many years of experience in automation, laser processing, inspection systems, and wet chemistry.   With currently around 1,400 employees, the Manz Group develops and produces in Germany, Slovakia, Hungary, Italy, China and Taiwan. Sales and service subsidiaries also exist in the USA and India.   Manz AG was founded in 1987 and has been listed on the Frankfurt Stock Exchange since 2006. In fiscal year 2020, the Group generated revenues of around 237 million euros.  

08/17/2021 10:00:00 CEST, Reutlingen Since market entry in 1995, Manz has established itself as an esteemed provider of end-to-end automation solutions in the display industry | From hardware to software – automation systems from a single source allow easy integration | Modularization of the systems for quick and easy extensions of production lines and capacities | Customers benefit from more efficient processes, lower manufacturing costs and competitive end products   Manz AG, a globally active high-tech engineering company with a comprehensive technology portfolio, has just delivered its 200th robot handling system for the biggest G10.5 display vacuum coating tool. For more than two decades, Manz has been providing innovative automation solutions along the entire display value chain in Asia. In the process, Manz is constantly developing these automation systems tailored to customers' needs in line with the latest production requirements, demonstrating "best-in-class" high-tech engineering in software and hardware again and again. Manz systems are particularly impressive due to their high quality, reliability, and ease of integration into existing processes.   With its many years of expertise in the development of hardware and software, Manz offers its customers individual solutions from a single source: from production planning to robotics and mechatronics, including optical inspection systems, to comprehensive drive and control systems. In particular, the carbon gripper system developed by Manz ensures maximum stability combined with low vibration and low weight, which virtually eliminates the breakage rate when handling the glass substrates, which are up to 2940 x 3370 mm in size and ultra-thin at 0.4 mm.   In partnership with display manufacturers, Manz's solutions ensure that complex production processes run more efficiently, manufacturing costs are reduced, and end products can be offered competitively. The modularization of production equipment and software allows both a simple and quick expansion of existing production lines and capacities as well as a problem-free conversion of the lines or complete process changeover.   Martin Drasch, CEO of Manz AG, comments: “In the field of automation systems for display manufacturing, we have gained a strong market position over the past years, as of date we have delivered more than 2,800 robot handling systems for all kind of display sizes. We have succeeded in this not least due to the close, partnership-based relationship with our customers; from the development phase to joint commissioning and individual service packages, they rely on our support and expertise. With our many years of experience in wet-chemical processes, we are proven experts in the field of display manufacturing up to Generation 10.5. The enormous increase in displays in modern cars in particular, but also the continuing demand for consumer electronics products such as smart watches, laptops or wearables, is leading to an ever-greater need for displays. With our technology and process experience, we are very well positioned to benefit from these growth trends in the display market in the future.”     The carbon gripper system developed by Manz ensures maximum stability combined with low vibration and low weight  

07/02/2021 10:00:00 CEST, Reutlingen Concept includes modules for planning, simulation, construction and scaling of integrated production systems from a single source | Manz with a holistic view of manufacturing processes in different industries thanks to many years of know-how in automation | Applicable for manufacturing processes with just a few individual steps up to fully automated turnkey production solutions   Manz AG, a global high-tech machine builder, is bundling its comprehensive range of products for the automation of production lines under the name Total Fab Solutions. The range of services offered by Total Fab Solutions includes all implementation steps for automation projects: from factory planning to process and material flow simulation or the integration of existing manufacturing processes to the construction, start-up and optimization of turnkey production solutions to be handed over.   Total Fab Solutions was designed for manufacturing companies across all industries and also covers the requirements of customers who produce under clean room conditions. Manz has already successfully implemented numerous reference projects for companies in the solar, electromobility and medical technology sectors in recent years.   Not off the shelf: Know-how for planning plus implementation expertise   "Thanks to our decades of automation competence, we take a holistic view of the planning and simulation phases of manufacturing processes and also offer implementation strength for the actual construction and commissioning of fully automated production systems," says Dr. Claus Kuhn, Head of Thin Film Solar Business Unit at Manz. "That is exactly what makes Total Fab Solutions unique on the market."   With Total Fab Solutions, Manz is addressing two fundamental challenges for manufacturing companies worldwide: In many places, existing production lines have to be modernized and automated as seamlessly as possible in the course of capacity expansion and under steadily increasing cost pressure. In addition, in view of technological change and the digitization of production processes, manufacturers often have to create new production capacities in a short period of time. "There are no off-the-peg solutions for this, but are always very individual and tailored to the respective customer needs," explained Dr. Claus Kuhn. “After all, the competitive advantage of many manufacturers of high-tech products, especially in large-volume mass production, is clearly the efficiency and reliability of the manufacturing processes. With Total Fab Solutions we are making an important contribution from the ground up to enable our customers to achieve cost leadership in their market."   What do manufacturing companies get with Total Fab Solutions from Manz?   Factory planning, process and material flow simulations: as a consulting service independent of the implementation of an automation project by Manz Development of the operating modes and a maintenance concept for a production to be automated: Optimization of the cycle times and the material flow including different buffer scenarios; Quality control and product tracking with various inspection systems Development of a production logic: With a holistic view, potentially critical production steps are identified and can, for example, be made redundant and therefore stable Definition of the optimal solution in each case for individual process steps: The greatest possible flexibility should allow manufacturing companies to integrate process machines from completely different suppliers into their processes Planning of automation and process technology: only the intelligent linking of process systems with the most complete automation possible makes a production resilient Realization of the automation or process project: implemented turnkey on request and beyond the ramp-up; with expansion options

05/27/2021 09:00:00 CEST, Reutlingen Order in the mid-single-digit million euro range from one of the world's leading microchip producers | Megatrends of digitalization, electromobility and autonomous driving spur market growth | CAGR of >20% expected for plant technology until 2024   Manz AG, a globally active high-tech equipment manufacturer with a comprehensive technology portfolio, is seeing increasing interest in equipment for realizing the innovative packaging process for microchips, Fan-Out Panel Level Packaging (FOPLP). Now, Manz has received a follow-up order in the mid-single-digit million euro range from one of the world's leading providers in the field of microchip manufacturing.   Martin Drasch, CEO of Manz AG, comments: “The electronics industry is currently characterized by high dynamics, especially against the background of rapid digitization. A basic prerequisite for this is increasing miniaturization, which means that increasingly smaller components have an increasingly greater performance capacity. In the automotive industry in particular, the megatrends of electromobility and autonomous driving will lead to a sharp rise in the number of chips installed. Here, our systems for the realization of fan-out panel level packaging will play a key role. This is because, in addition to a significant reduction in volume, thickness, weight and manufacturing costs of the packaging, FOPLP also has a significantly positive impact on the thermal conduction and speed of the components.”   In recent years electromobility and autonomous driving have already led to a sharp increase in the number of sensors installed in cars. While in 2016 sensors amounted to between 60 and 100 per car, by 2020 there were already more than 200 sensors. The number of chips in smartphones has also increased enormously. In view of these developments, suppliers in the fan-out panel level packaging sector can expect strong revenue growth for production equipment of more than 20% per year in the coming years.   "With our integrated and automated production solutions, we as a high-tech equipment manufacturer create the basis for a fast time-to-market while at the same time improving the performance parameters of the end products and reducing production costs. These are clear competitive advantages for our customers and a very good position for us to benefit from the market potential," Martin Drasch summarizes.