Glass substrates are considered a key material for next-generation advanced semiconductor packaging. Compared with organic substrates, their ultra-flat surfaces and superior thermal stability enable chips to achieve higher integration density and performance in the AI era.
An IC substrate is a key element in semiconductor packaging, delivering both mechanical support and electrical interconnection for integrated circuits. It shields the bare die and links it to the PCB’s trace network through a multilayer grid of vias and conductors, enabling one or more chips to communicate with the rest of the system. As an intermediate assembly, the substrate secures the IC and carries the internal wiring that bridges the chip to the board.
Glass forming processes enable production in panel format and various thicknesses, providing an additional method for manufacturing with low electrical loss, especially at high frequencies. The high stiffness and adjustable coefficient of thermal expansion offer advantages in controlling the deformation of glass core substrates and bonded stacks used for numerous carrier applications such as through-glass vias (TGV).
The increasing use of glass solutions in the industry has led to significant advances in downstream processes such as glass handling and metallization of vias/surfaces. The use of tool sets and processes for panel manufacturing enables the desired cost structures to be achieved in the industry.
We offer highly selective equipment for the TGV and RDL build-up process, ensuring the maintenance of high-quality processes. Our flexible and scalable solutions are optimized to meet the specific requirements of our customers.
• Glass substrate cleaner
• Glass etching
• Vias cleaner
• Through-hole plating
• Double-sided plating
Focusing on critical processes of IC substrates, our equipment meets the criteria of manufacturers for modern electronics.
