Built on CoWoS, CoPoS replaces wafers with square substrates, enhancing panel flexibility and chip compatibility. This increases production capacity and improves manufacturing adaptability for diverse packaging needs.
Manz’s CoPoS (Chip-on-Panel-on-Substrate) represents a broad framework of panel-based manufacturing techniques utilized within the semiconductor industry. It encompasses technologies such as IC substrate production — whether organic or glass-based — and subsequent package assembly. It further incorporates Panel Level Packaging (PLP), employing Redistribution Layer (RDL) technologies on large panel carriers to enhance processing efficiency and scalability.
The rise of AI and high-performance computing is reshaping landscape of semiconductor packaging. As chip sizes grow — with larger dies, and heterogeneous integration becoming the norm — the demand for scalable, panel-level solutions is more critical than ever. In response, Manz’s CoPoS (Chip-on-Panel-on-Substrate) technology delivers solutions for producing larger form factors across a wide range of chip packaging frameworks and materials, enhancing scalability, flexibility, and production efficiency.
From Round Wafers to Square Panels: CoPoS—The Future Trend in Semiconductor Packaging
