IC substrate and Glass Core

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Manz Asia

Manz Asia is a leading manufacturer of equipment for semiconductor panel-level packaging. With a core focus on panel-level packaging technology, the company drives innovation in both the technology and processes of panel packaging.

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IC substrate and Glass Core

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IC substrate and Glass Core

Advanced IC Substrate Production Solutions

With the rapid growth of demand for AI and HPC chip testing, probe cards have become a key factor in overall test yield. We provide a comprehensive range of wet process equipment, covering surface treatment, development, etching, stripping, and plating, to help customers manufacture MLO probe card substrates and achieve higher reliability and competitiveness in semiconductor testing. Meanwhile, we are expanding into next-generation advanced packaging materials with equipment solutions for glass substrates. Leveraging their excellent flatness and thermal stability, our solutions enable higher-density interconnects and superior chip performance for the AI era.

Probe Card MLO – The Key to Achieving High-Accuracy Testing

Probe card MLO (multi-layer organic substrate) plays a critical role in advanced chip testing. It must support high layer counts, deliver excellent electrical interconnection performance, withstand high-frequency and high-current signal transmission, and provide sufficient mechanical strength to endure repeated probe contact without mechanical fatigue.

These demanding structural and electrical requirements make probe card MLO one of the most challenging, yet most critical, core substrate platforms in the semiconductor test market.
With our wet process equipment solutions, we help customers build probe card MLO production lines that accelerate time-to-market and secure a leading position in the industry.

“Glass core” and ‘Through-glass vias’ Technologies

Glass forming processes enable production in panel format and various thicknesses, providing an additional method for manufacturing with low electrical loss, especially at high frequencies. The high stiffness and adjustable coefficient of thermal expansion offer advantages in controlling the deformation of glass core substrates and bonded stacks used for numerous carrier applications such as through-glass vias (TGV).

The increasing use of glass solutions in the industry has led to significant advances in downstream processes such as glass handling and metallization of vias/surfaces. The use of tool sets and processes for panel manufacturing enables the desired cost structures to be achieved in the industry.

We offer highly selective equipment for the TGV and RDL build-up process, ensuring the maintenance of high-quality processes. Our flexible and scalable solutions are optimized to meet the specific requirements of our customers.

• Glass substrate cleaner

• Glass etching

• Vias cleaner

• Through-hole plating

• Double-sided plating

Your benefits at a glance:

Specialized equipment streamlines TGV and RDL build-up processes, ensuring reliability in glass core substrates and bonded stacks
Innovative handling techniques optimize workflows, reducing downtime and boosting productivity
Scalable and customizable solutions reduce production costs while effectively addressing the diverse needs of our customers