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FOPLP
Panel-level packaging adapts wafer-level techniques from round wafers to square panels, maximizing area utilization and throughput. High-density RDL metallization and interconnect design ensure reliable connections across substrates and materials, improving scalability, flexibility, and manufacturing efficiency.​
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IC substrate and Glass Core
With the rapid growth of demand for AI and HPC chip testing, probe cards have become a key factor in overall test yield. We provide a comprehensive range of wet process equipment, covering surface treatment, development, etching, stripping, and plating, to help customers manufacture MLO probe card substrates and achieve higher reliability and competitiveness in semiconductor testing. Meanwhile, we are expanding into next-generation advanced packaging materials with equipment solutions for glass substrates. Leveraging their excellent flatness and thermal stability, our solutions enable higher-density interconnects and superior chip performance for the AI era.
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Digital Printing
Whether functional or direct-to-product, direct-to-object or even direct-to-shape printing. It's all about high-quality and, above all, direct printing and finishing of products, components and surfaces. As part of its comprehensive technology portfolio, Manz Asia offers engineering solutions for the industrialization of digital printing using inkjet printing technology.
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Contract Manufacturing
With innovative ideas, our expert teams with decades of know-how, as well as state-of-the-art and extremely well-equipped production facilities in Europe and Asia we are a leading high-tech partner for semiconductor, medical devices, precision equipment (such as food-related systems), systems engineering，and parts manufacturing for a variety of customers in various branches.
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