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Desmear (DSM) & Plating Through Hole (PTH)
Our continuous horizontal DSM&PTH equipment, purpose-built for high-aspect-ratio AI server PCB production, together with our gantry-type DSM&PTH designed specifically for probe card MLO manufacturing, jointly provide a complete and reliable solution to meet the stringent process requirements of today’s advanced electronic products.
Horizontal DSM& PTH for High-Aspect-Ratio PCBs
High aspect ratio HDI (High Density Interconnect) PCBs are increasingly integral to cutting-edge technologies, including AI servers, 5G servers, base stations, and low-orbit satellites.

These applications require high transmission capacity and the ability to handle higher current densities, making high aspect ratio PCBs crucial components in these advanced systems.
Our desmear and PTH (Plating Through Hole) equipment is specifically engineered to produce high aspect ratio PCBs. These PCBs feature small vias on thick boards, which are vital for enhancing signal transmission and heat dissipation.

As the demand for faster, more reliable data transmission and higher current density continues to rise, we remain at the forefront of PCB manufacturing technology, providing solutions that meet the rigorous requirements of today’s advanced electronics.
DSM & PTH Designed for Probe Card MLO Processes
Designed to remove resin smear and properly condition the hole walls after drilling. A high-quality seed layer provides a reliable base for copper plating, enhancing adhesion and via stability to ensure consistent quality and high yield in downstream processes.
Your Benefits
  • Equipped with ultrasonic cleaner, capable of thoroughly removing dirt and eliminating bubbles inside the holes.
  • High stability in automated transmission.
  • Special water-resistant roller design effectively prevents chemical carryover and avoids cross-contamination.
  • A cleaning system is installed inside the tank, making gear and tank wall cleaning easy.
Our capability
Desmear & PTH HAR PCB Probe card MLO
Panel Size max. 610 x 610 mm, min. 250 x 250 mm 355 x 400 mm
Thickness 2.0 – 6.0 mm 0.1 – 4 mm
Through hole min. 0.2 mm min. 0.1 mm
Blind Via Hole min. 0.15 mm min. 0.05 mm
Aspect ratio 1:30 1:15
Contact us
Manz Asia
Manz Taiwan Ltd. 4F, No. 168-1, Zhongyuan Rd. 320021 Taoyuan City Taiwan
+886 3 4529811
info.tw@manz.com