High Aspect Ratio PCBs: Crucial for AI, 5G, and Satellite Innovations
High aspect ratio HDI (High Density Interconnect) PCBs are increasingly integral to cutting-edge technologies, including AI servers, 5G servers, base stations, and low-orbit satellites.
These applications require high transmission capacity and the ability to handle higher current densities, making high aspect ratio PCBs crucial components in these advanced systems.
These applications require high transmission capacity and the ability to handle higher current densities, making high aspect ratio PCBs crucial components in these advanced systems.