From laboratory and pilot production to small-series and mass production, Manz Asia provides comprehensive equipment solutions for wet chemistry, plating, digital printing, automation, and proprietary software integration, meeting the Redistribution Layer (RDL) process requirements. These technologies are widely applied in Fan-Out Panel-Level Packaging (FOPLP), Through Glass Via (TGV), and IC substrates, addressing every stage of semiconductor packaging manufacturing.
By enhancing production efficiency, optimizing process quality, and strengthening market competitiveness, Manz Asia empowers the semiconductor industry to achieve higher standards of excellence.
Innovative Technologies
Our semiconductor packaging production systems are built on more than 40 years of experience in automation and wet chemistry for the display, IC substrate, and PCB industries. Through continuous innovation and the advancement of production technologies, we have developed digital printing solutions that help reduce manufacturing costs and support ESG targets.
Machines and Production Lines
We offer a complete range of modern production solutions — from customized individual machines for laboratory, pilot, and small-series production to standardized modules, systems, and turnkey solutions for efficient high-volume manufacturing. Our customers benefit from high resource efficiency, increased throughput, and shorter time-to-market.
Manz Worldwide
We are where our customers are. We are always available for you at our local locations.
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