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FOPLP
Panel-level packaging adapts wafer-level techniques from round wafers to square panels, maximizing area utilization and throughput. High-density RDL metallization and interconnect design ensure reliable connections across substrates and materials, improving scalability, flexibility, and manufacturing efficiency.​
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IC substrate and Glass Core
Glass substrates are considered a key material for next-generation advanced semiconductor packaging. Compared with organic substrates, their ultra-flat surfaces and superior thermal stability enable chips to achieve higher integration density and performance in the AI era.
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Digital Printing
Whether functional or direct-to-product, direct-to-object or even direct-to-shape printing. It's all about high-quality and, above all, direct printing and finishing of products, components and surfaces. As part of its comprehensive technology portfolio, Manz offers engineering solutions for the industrialization of digital printing using inkjet printing technology.
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Contract Manufacturing
With innovative ideas, our expert teams with decades of know-how, as well as state-of-the-art and extremely well-equipped production facilities in Europe and Asia we are a leading high-tech partner for semiconductor, medical devices, precision equipment (such as food-related systems), systems engineering,and parts manufacturing for a variety of customers in various branches.