• 05/20/2025 16:15:00 CEST Driving Panel-Level Packaging Advancements with New R&D Center and Strategic Expansion in Asia   Manz Asia, a global leader in semiconductor panel-level packaging equipment, is accelerating the mass production and commercialization of CoPoS (Chip-on-Panel-on-Substrate) technology. Leveraging nearly four decades of expertise in synchronized performance across wet processing, plating, and fully integrated automation, Manz Asia enables advancements in takt time, throughput, and uniformity—driving the industry's transition to panel-level packaging, a critical enabler for improving productivity and accommodating larger chip packaging demands.   With deep roots in the PCB, IC substrate, and display industries, Manz Asia has strategically expanded its focus into semiconductor advanced packaging. The introduction of CoPoS — the panelized evolution of CoWoS technology — has now become a widely recognized standard across the industry, helping drive the transformation from round to square packaging formats for next-generation devices.   Recognizing the pivotal role of redistribution layer (RDL) performance in conductivity, stability, and yield for CoPoS, Manz Asia has developed the latest highly specialized etching and plating equipment tailored to support various packaging structures and substrate types. In parallel, the company's commitment to green manufacturing and smart production practices is exemplified by its development of inkjet printing equipment, enables maskless, precise material deposition on substrates like PI, ABF, EMC, silicon, and glass. This simplifies metallization, boosting efficiency, sustainability, yield, and flexibility in semiconductor manufacturing.     Manz Asia sets up a Semiconductor Innovation and R&D Center in Taiwan to support equipment development, process validation, and customer sample projects.   To further accelerate innovation, Manz Asia has established a dedicated Semiconductor Innovation R&D Center, equipped with key Redistribution Layer (RDL) and metallization process equipment. This facility supports both experimental development and mass production validation, playing a vital role in optimizing process integration, system implementation, and overall production line efficiency. Through close collaboration with customers, the center enables faster commercialization of next-generation semiconductor packaging technologies.   "By establishing our R&D center, we are not only advancing CoPoS technologies but also reinforcing our leading position in the advanced panel-level packaging field," said Robert Lin, General Manager at Manz Asia. "At the same time, to meet the growing demand in advanced packaging, Manz Asia completed the purchasing agreement of Manz AG’s semiconductor-focused legal entity in Asia during Q2 2025. This strategic move strengthens our operational foundation, expands our regional footprint, and enhances our ability to support localized supply chains, delivering faster and more flexible service to customers worldwide."   Looking ahead, Manz Asia remains firmly committed to driving innovation in semiconductor packaging equipment. By collaborating closely with customers and industry partners, the company aims to deliver increasingly efficient, competitive, and sustainable solutions that address the evolving needs of the global semiconductor industry.     Manz Asia General Manager Robert Lin (left) and Manz AG Representative Martin Mucha (right) sign the purchasing agreement.   For the latest capabilities of Manz CoPoS solutions and inkjet printing equipment with live demo, visit us at SEMICON SEA 2025, booth #L1314. We warmly welcome you to explore our newest performance advancements.   About Manz AsiaManz Asia is a leading manufacturer of advanced semiconductor equipment, driving technological innovation and process excellence within the CoPoS (CoWoS panelization) technology framework for panel-level packaging.   From laboratory and pilot production to small-series and mass production, Manz provides comprehensive equipment solutions for wet chemistry, plating, digital printing, automation, and proprietary software integration, meeting the Redistribution Layer (RDL) process requirements. These technologies are widely applied in Fan-Out Panel-Level Packaging (FOPLP), Through Glass Via (TGV), and IC substrates, addressing every stage of semiconductor packaging manufacturing.   By enhancing production efficiency, optimizing process quality, and strengthening market competitiveness, Manz Asia empowers the semiconductor industry to achieve higher standards of excellence.   Contact: Manz Asia Marketing & Communications Director Yvonne Huang +886 3 452 9811 yvonne.huang@manz.com

• 02/28/2025 16:51:00 CET, Reutlingen   Reutlingen, 28 February 2025 – The insolvency administrator of Manz AG, attorney Mr. Martin Mucha, and Mr. Robert Lin, General Manager of Manz China and Manz Taiwan, signed a purchase agreement today, 28 February 2025, for the acquisition of the Manz Asia sub-group by Mr. Lin. The proceeds from the sale will go to the insolvency estate of Manz AG. The purchase price remains confidential.   The sub-group Manz Asia Ltd., headquartered in Hong Kong (PR China), includes the subsidiaries Manz China Suzhou Ltd (Suzhou, PR China), Manz Chungli Ltd. (Chungli, Taiwan), Manz Taiwan Ltd (Chungli, Taiwan) and Manz India Private Ltd. (New Delhi, India). The companies in Taiwan and PR China serve as production, development, sales, and service locations of Manz group, while customers in India are locally supported with sales and service offerings.   Manz’s Asian business focuses on manufacturing equipment for semiconductor production, including the FOPLP process (Panel Level Packaging) and innovative digital printing solutions, meeting the increasing demands for performance and efficiency in the rapidly growing semiconductor industry. Additionally, contract manufacturing is provided for renowned clients. Proximity to customers is crucial given the high complexity of manufacturing processes.   Mr. Robert Lin has been with Manz since 15 years and served as General Manager of Manz China and Manz Taiwan. Under his leadership, a dedicated sales team and a more defined market presence were established, significantly increasing market visibility.   With the management buy-out, the foundation for the company’s continued development is now in place. In his new role as an investor, Mr. Robert Lin will take over all approximately 380 Manz employees in the Asia region and plans to further expand the existing strategic direction. The purchase will be backed by strong investors with long term experience in the semiconductor industry. This will secure the necessary funds for the future growth strategy of Manz Asia.   Insolvency administrator Martin Mucha expressed satisfaction with the sale to the experienced Manz manager: “Mr. Robert Lin has the full trust of the Manz AG Management Board. We are confident that the Asian business is in excellent hands with Mr. Lin and his team.”