• Taoyuan, Taiwan, Feb. 23rd 2026 –  XTPL (WSE:XTP), a developer of Ultra-Precise Dispensing (UPD) technology for nanomaterial deposition, has entered a strategic partnership with Manz Asia to support the development and commercialization of advanced semiconductor packaging applications. Under the partnership, XTPL will install a Delta Printing System in Manz Asia’s  Semiconductor Innovation and R&D centre in Taoyuan, Taiwan, establishing a local capability for process development, testing, and validation. The facility will enable customers to evaluate specific applications and establish a pathway from prototype development to volume production. The partnership combines XTPL’s proprietary dispensing technology with Manz Asia’s expertise in advanced semiconductor manufacturing systems and process development. The collaboration will focus on joint engagement with third-party customers and the evaluation of application-specific commercial opportunities. XTPL’s UPD technology enables highly controlled deposition of functional nanomaterials with feature sizes ranging from tens of micrometres down to below one micrometre. The technology is already qualified for high-volume production in display applications and is currently being evaluated for additional applications in advanced electronics, including inline manufacturing, multichip module packaging, and advanced electronic structures. “I am delighted to start the partnership with Manz Asia - a company with a strong position and deep expertise in the semiconductor industry in Taiwan and Asia. It is only natural for us to work side by side with a partner who knows this ecosystem from the inside. The synergy between XTPL's unique ultra-precise dispensing technology and Manz Asia's competencies in advanced semiconductor packaging is a natural fit. That is precisely why I am confident this collaboration will translate into tangible business opportunities for both sides.,” said Filip Granek, CEO of XTPL. Robert Lin, CEO of Manz Asia, added: “This strategic partnership with XTPL expands our printing capabilities into ultra-precise material deposition, enabling a wide range of advanced semiconductor applications. The technology supports both conductive and non-conductive materials across 2D, 2.5D and 3D substrates in diverse manufacturing scenarios. By combining XTPL’s dispensing technology with Manz’s automation and process integration expertise, we broaden our portfolio and provide more flexible manufacturing solutions, helping customers accelerate innovation and move efficiently from prototype to volume production.” XTPL and Manz Asia partner to accelerate adoption of ultra-precise dispensing technology in Asia. About Manz Asia Manz Asia delivers semiconductor equipment and integrated solutions built on core technologies in wet chemistry, plating, digital printing, automation, and software integration. The company’s expertise spans advanced packaging, including high-density PLP/FOPLP, and IC substrate processing for both glass and organic core architectures. Supporting customers from R&D through high-volume manufacturing, Manz Asia helps accelerate time-to-market, improve yield performance, and enhance competitiveness in the rapidly evolving semiconductor industry. To find out more, go to: www.manz.com.tw/en About XTPL XTPL S.A. (WSE:XTP) develops and commercializes solutions based on its proprietary Ultra-Precise Dispensing (UPD) technology, enabling highly controlled deposition of functional nanomaterials with feature sizes from below 1 µm to over 50 µm. The technology is applicable to advanced electronics markets including semiconductors, displays, RDL, multichip modules, and advanced PCB applications, and is already qualified for high-volume commercial production in display manufacturing. Since 2019, XTPL S.A. has been listed on the Main Market of the Warsaw Stock Exchange, and since 2020 it has also been listed on the Open Market in Frankfurt. To find out more, go to: www.xtpl.com Contact: Manz Taiwan Ltd. Yvonne Huang   |   Director Marketing & Communications Phone: +886 3 452 9811 ext. 3399 E-Mail: yvonne.huang@manz.com

• 05/20/2025 16:15:00 CEST Driving Panel-Level Packaging Advancements with New R&D Center and Strategic Expansion in Asia   Manz Asia, a global leader in semiconductor panel-level packaging equipment, is accelerating the mass production and commercialization of CoPoS (Chip-on-Panel-on-Substrate) technology. Leveraging nearly four decades of expertise in synchronized performance across wet processing, plating, and fully integrated automation, Manz Asia enables advancements in takt time, throughput, and uniformity—driving the industry's transition to panel-level packaging, a critical enabler for improving productivity and accommodating larger chip packaging demands.   With deep roots in the PCB, IC substrate, and display industries, Manz Asia has strategically expanded its focus into semiconductor advanced packaging. The introduction of CoPoS — the panelized evolution of CoWoS technology — has now become a widely recognized standard across the industry, helping drive the transformation from round to square packaging formats for next-generation devices.   Recognizing the pivotal role of redistribution layer (RDL) performance in conductivity, stability, and yield for CoPoS, Manz Asia has developed the latest highly specialized etching and plating equipment tailored to support various packaging structures and substrate types. In parallel, the company's commitment to green manufacturing and smart production practices is exemplified by its development of inkjet printing equipment, enables maskless, precise material deposition on substrates like PI, ABF, EMC, silicon, and glass. This simplifies metallization, boosting efficiency, sustainability, yield, and flexibility in semiconductor manufacturing.     Manz Asia sets up a Semiconductor Innovation and R&D Center in Taiwan to support equipment development, process validation, and customer sample projects.   To further accelerate innovation, Manz Asia has established a dedicated Semiconductor Innovation R&D Center, equipped with key Redistribution Layer (RDL) and metallization process equipment. This facility supports both experimental development and mass production validation, playing a vital role in optimizing process integration, system implementation, and overall production line efficiency. Through close collaboration with customers, the center enables faster commercialization of next-generation semiconductor packaging technologies.   "By establishing our R&D center, we are not only advancing CoPoS technologies but also reinforcing our leading position in the advanced panel-level packaging field," said Robert Lin, General Manager at Manz Asia. "At the same time, to meet the growing demand in advanced packaging, Manz Asia completed the purchasing agreement of Manz AG’s semiconductor-focused legal entity in Asia during Q2 2025. This strategic move strengthens our operational foundation, expands our regional footprint, and enhances our ability to support localized supply chains, delivering faster and more flexible service to customers worldwide."   Looking ahead, Manz Asia remains firmly committed to driving innovation in semiconductor packaging equipment. By collaborating closely with customers and industry partners, the company aims to deliver increasingly efficient, competitive, and sustainable solutions that address the evolving needs of the global semiconductor industry.     Manz Asia General Manager Robert Lin (left) and Manz AG Representative Martin Mucha (right) sign the purchasing agreement.   For the latest capabilities of Manz CoPoS solutions and inkjet printing equipment with live demo, visit us at SEMICON SEA 2025, booth #L1314. We warmly welcome you to explore our newest performance advancements.   About Manz AsiaManz Asia is a leading manufacturer of advanced semiconductor equipment, driving technological innovation and process excellence within the CoPoS (CoWoS panelization) technology framework for panel-level packaging.   From laboratory and pilot production to small-series and mass production, Manz provides comprehensive equipment solutions for wet chemistry, plating, digital printing, automation, and proprietary software integration, meeting the Redistribution Layer (RDL) process requirements. These technologies are widely applied in Fan-Out Panel-Level Packaging (FOPLP), Through Glass Via (TGV), and IC substrates, addressing every stage of semiconductor packaging manufacturing.   By enhancing production efficiency, optimizing process quality, and strengthening market competitiveness, Manz Asia empowers the semiconductor industry to achieve higher standards of excellence.   Contact: Manz Asia Marketing & Communications Director Yvonne Huang +886 3 452 9811 yvonne.huang@manz.com