• Joint Lab-to-Fab inkjet equipment combines Epson’s precision printhead technology with Manz Asia’s equipment and process expertise to enable scalable manufacturing Taoyuan, Taiwan — March 12, 2026 — A leading semiconductor advanced packaging equipment manufacturer Manz Asia today announced a strategic partnership with Seiko Epson Corporation (Epson) aimed at accelerating the adoption of advanced inkjet technology in semiconductor manufacturing. The collaboration combines Manz Asia’s expertise in semiconductor equipment engineering, process integration, and intelligent software systems with Epson’s industry-leading inkjet printhead technology. By bringing together these complementary capabilities, the two companies are developing scalable Lab-to-Fab inkjet equipment designed to support next-generation semiconductor manufacturing applications. The jointly developed inkjet equipment is available as a series of systems covering R&D, pilot production, and mass manufacturing, enabling semiconductor manufacturers to expand applications, validate materials efficiently, optimize process parameters, and scale seamlessly from development to high-volume production. Manz Asia’s inkjet system solutions with high compatibility features enable precise 2D and 3D printing of conductive, photoresist, and specialized functional inks on a variety of products, components, and surfaces. The systems are well-suited for key semiconductor processes, including patterning 2.5D/3D antenna traces, heatsink layers, and bonding layers for RFIC, PMIC, and CPO devices. All of these applications can be handled with Manz Asia inkjet system solutions, providing flexible, scalable, and cost-effective solutions for advanced packaging and emerging device architectures. Robert Lin, CEO of Manz Asia, said: “Inkjet technology is transforming semiconductor manufacturing. Together with Epson, we are delivering precise and scalable inkjet equipment solutions that enable manufacturers to validate processes and scale from R&D to high-volume production. Our Taiwan R&D center serves as an open innovation hub, uniting materials partners, printhead providers, and key suppliers, turning innovative concepts into practical manufacturing outcomes and helping customers achieve faster time-to-market and improved production efficiency.” Shunya Fukuda, COO of Epson’s IJS Operations Division, added: “Digital additive manufacturing using inkjet technology is expected to become a key technology supporting the evolution of semiconductor packaging. By leveraging Epson’s high-precision droplet control technology and volume production know-how developed, we works together with Manz Asia to build a scalable manufacturing platform bridging laboratory development and volume production. Through this initiative, Epson aims to contribute to the sustainable development of the semiconductor industry.” This collaboration marks a step toward more flexible, efficient, and sustainable semiconductor production, leveraging complementary core technologies to deliver long-term differentiation and measurable value to global customers. Picture 1: RDJet100 ─ a laboratory equipment for validating new functional inks and substrates in semiconductor advanced packaging metallization process. Powered by Epson printhead. Picture 2: ICJet series ─ Industrial production equipment for frontend and backend semiconductor processes, supporting wafer and panel substrates. Picture 3: Manz Asia and Epson have teamed to deliver inkjet system solutions for semiconductor processes—2.5D/3D antennas traces, heatsinks, and bonding layers for RFIC/PMIC/CPO—enabling transformative production advances. About Manz Asia Manz Asia delivers semiconductor equipment and solutions built on core technologies in wet chemistry, plating, inkjet printing, automation, and software integration. Our expertise covers advanced packaging (High-Density PLP / FOPLP) and IC substrate processing (glass and organic core), supporting customers from R&D to high-volume manufacturing. Through system solutions, contract manufacturing, and sales representation, we help customers accelerate time-to-market, boost yield, and stay competitive in the fast-evolving semiconductor industry. www.manz.com.tw/en About SEIKO EPSON Epson is a global technology leader whose philosophy of efficient, compact, and precise innovation enriches lives and helps create a better world. Epson is focused on solving societal challenges through innovations in printing, manufacturing, and visual technologies, with the goal of becoming carbon negative and eliminating the use of exhaustible underground resources by 2050.Led by Seiko Epson Corporation, the Epson Group generates annual sales of more than JPY 1 trillion. corporate.epson/en/ Contact: Manz Taiwan Ltd. Yvonne Huang Director Marketing & Communications Phone: +886 3 452 9811 ext. 3399 E-Mail: yvonne.huang@manz.com

• Taoyuan, Taiwan, Feb. 23rd 2026 –  XTPL (WSE:XTP), a developer of Ultra-Precise Dispensing (UPD) technology for nanomaterial deposition, has entered a strategic partnership with Manz Asia to support the development and commercialization of advanced semiconductor packaging applications. Under the partnership, XTPL will install a Delta Printing System in Manz Asia’s  Semiconductor Innovation and R&D centre in Taoyuan, Taiwan, establishing a local capability for process development, testing, and validation. The facility will enable customers to evaluate specific applications and establish a pathway from prototype development to volume production. The partnership combines XTPL’s proprietary dispensing technology with Manz Asia’s expertise in advanced semiconductor manufacturing systems and process development. The collaboration will focus on joint engagement with third-party customers and the evaluation of application-specific commercial opportunities. XTPL’s UPD technology enables highly controlled deposition of functional nanomaterials with feature sizes ranging from tens of micrometres down to below one micrometre. The technology is already qualified for high-volume production in display applications and is currently being evaluated for additional applications in advanced electronics, including inline manufacturing, multichip module packaging, and advanced electronic structures. “I am delighted to start the partnership with Manz Asia - a company with a strong position and deep expertise in the semiconductor industry in Taiwan and Asia. It is only natural for us to work side by side with a partner who knows this ecosystem from the inside. The synergy between XTPL's unique ultra-precise dispensing technology and Manz Asia's competencies in advanced semiconductor packaging is a natural fit. That is precisely why I am confident this collaboration will translate into tangible business opportunities for both sides.,” said Filip Granek, CEO of XTPL. Robert Lin, CEO of Manz Asia, added: “This strategic partnership with XTPL expands our printing capabilities into ultra-precise material deposition, enabling a wide range of advanced semiconductor applications. The technology supports both conductive and non-conductive materials across 2D, 2.5D and 3D substrates in diverse manufacturing scenarios. By combining XTPL’s dispensing technology with Manz’s automation and process integration expertise, we broaden our portfolio and provide more flexible manufacturing solutions, helping customers accelerate innovation and move efficiently from prototype to volume production.” XTPL and Manz Asia partner to accelerate adoption of ultra-precise dispensing technology in Asia. About Manz Asia Manz Asia delivers semiconductor equipment and integrated solutions built on core technologies in wet chemistry, plating, digital printing, automation, and software integration. The company’s expertise spans advanced packaging, including high-density PLP/FOPLP, and IC substrate processing for both glass and organic core architectures. Supporting customers from R&D through high-volume manufacturing, Manz Asia helps accelerate time-to-market, improve yield performance, and enhance competitiveness in the rapidly evolving semiconductor industry. To find out more, go to: www.manz.com.tw/en About XTPL XTPL S.A. (WSE:XTP) develops and commercializes solutions based on its proprietary Ultra-Precise Dispensing (UPD) technology, enabling highly controlled deposition of functional nanomaterials with feature sizes from below 1 µm to over 50 µm. The technology is applicable to advanced electronics markets including semiconductors, displays, RDL, multichip modules, and advanced PCB applications, and is already qualified for high-volume commercial production in display manufacturing. Since 2019, XTPL S.A. has been listed on the Main Market of the Warsaw Stock Exchange, and since 2020 it has also been listed on the Open Market in Frankfurt. To find out more, go to: www.xtpl.com Contact: Manz Taiwan Ltd. Yvonne Huang   |   Director Marketing & Communications Phone: +886 3 452 9811 ext. 3399 E-Mail: yvonne.huang@manz.com